Multilayer electronic component having first and second internal elctrode patterns alternately stacked, and method of manufacturing the same

ABSTRACT

A multilayer electronic component includes a body, first and second external electrodes, and first and second side parts. The body includes a multilayer structure in which first and second internal electrode patterns are alternately stacked and contains a dielectric material. The first and second side parts are disposed on outer surfaces of the body to face each other. The first and second external electrodes are disposed on outer surfaces of the body to face each other. The first internal electrode patterns are exposed to a third surface and a fifth surface of the body on which the first external electrode and the first side part are disposed, respectively. Additionally, the second internal electrode patterns are exposed to a fourth surface and a sixth surface of the body on which the second external electrode and the second side part are disposed, respectively.

CROSS-REFERENCE TO RELATED APPLICATION

This application is Continuation Patent Application of U.S. patentapplication Ser. No. 15/217,165, filed on Jul. 22, 2016 which claims thepriority and benefit of Korean Patent Application No. 10-2015-0188335,filed on Dec. 29, 2015 with the Korean Intellectual Property Office, thedisclosures of which are incorporated herein by reference.

BACKGROUND

The present disclosure relates to a multilayer electronic component anda method of manufacturing the same, and more particularly, to amultilayer ceramic capacitor and a method of manufacturing the same.

A multilayer ceramic capacitor may include a multilayer structure formedby stacking a plurality of sheets containing dielectric materials,external electrodes formed on outer surfaces of the multilayer structureand having different polarities, and internal electrodes alternatelystacked within the multilayer structure and each connected to arespective one of the external electrodes.

The internal electrodes alternately formed between the plurality ofsheets are connected to each other to have different polarities in orderto generate capacitive coupling, whereby the multilayer ceramiccapacitor has a capacitance value.

Recently, in order to increase capacitance of the multilayer ceramiccapacitor and miniaturize the multilayer ceramic capacitor, variousattempts to slim dielectric sheets to thereby increase the number ofstacked dielectric sheets within a same sized component have beenprovided. Further, efforts have been made to optimize a margin part of abody having a multilayer structure in order to secure an increase inoverlapping area between the internal electrodes.

SUMMARY

A multilayer electronic component of the present disclosure providesmaximum coverage between internal electrode patterns to secure maximumcapacitance while preventing short circuits between internal electrodepatterns. The disclosure further details a method of manufacturing thesame.

According to an aspect of the present disclosure, a multilayerelectronic component may include a body, first and second externalelectrodes, and first and second side parts. The body includes amultilayer structure in which first and second internal electrodepatterns are alternately stacked and contains a dielectric material. Thefirst and second side parts are disposed on outer surfaces of the bodyto face each other. The first and second external electrodes aredisposed on outer surfaces of the body to face each other. The firstinternal electrode patterns are exposed to a third outer surface and afifth outer surface of the body on which the first external electrodeand the first side part are disposed, respectively. Additionally, thesecond internal electrode patterns are exposed to a fourth outer surfaceand a sixth surface outer of the body on which the second externalelectrode and the second side part are disposed, respectively.

According to another aspect of the present disclosure, a method ofmanufacturing a multilayer electronic component may include formingfirst and second ceramic green sheets using a slurry containing a powderhaving a dielectric property, a binder, and a solvent. First and secondinternal electrode base patterns are printed on one surface of the firstand second ceramic green sheets, respectively, the first and secondinternal electrode base patterns including one or more strip shapes thatare the same shape as each other. The first ceramic green sheets,including the first internal electrode base patterns, and the secondceramic green sheets, including the second internal electrode basepatterns, are alternatively stacked. A multilayer bar in which the firstand second ceramic green sheets are stacked is cut to form individualbodies each including a multilayer structure in which first and secondinternal electrode patterns are alternately stacked and containing adielectric material. First and second side parts are disposed on twoopposing outer surfaces of each body, and first and second externalelectrodes are disposed on two other opposing outer surfaces of eachbody.

According to a further aspect of the present disclosure, a multilayerelectronic component includes a body including alternately stacked firstand second internal electrodes disposed in a dielectric body. The firstand second internal electrodes each have rectangular strip shapes thatare the same shape as each other, and the first and second internalelectrodes are stacked in a vertical direction such that the firstinternal electrodes are offset in a horizontal direction with respect tothe second internal electrodes in the body.

According to another aspect of the present disclosure, a method includesalternately stacking first and second ceramic green sheets in a verticaldirection to form a multilayer bar, where the first and second ceramicgreen sheets each respectively have first and second internal electrodesdisposed thereon, each of the first and second internal electrodesincludes two or more rectangular strip shapes that are the same shape aseach other and spaced apart from each other, and the first and secondceramic green sheets are stacked such that the first internal electrodesare offset in a horizontal direction with respect to the second internalelectrodes in the multilayer bar. In turn, the multilayer bar is cutalong at least one vertical cutting surface to form two or moreindividualized bodies, where the cutting of the multilayer bar exposeson one vertical cutting surface only the first internal electrodes fromamong the first and second internal electrodes.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a schematic perspective view of a multilayer electroniccomponent according to an exemplary embodiment;

FIGS. 2A through 2F are schematic cross-sectional views of respectiveouter surfaces of a body of a multilayer electronic component such asthat shown in FIG. 1;

FIG. 3 is an exploded perspective view showing internal electrodepatterns within the body of a multilayer electronic component such asthat shown in FIG. 1;

FIG. 4 is a schematic perspective view of a mounting board on which themultilayer electronic component of FIG. 1 is mounted;

FIGS. 5A and 5B are views illustrating a first internal electrode basepattern used in a method of manufacturing a multilayer electroniccomponent such as that shown in FIG. 1;

FIGS. 6A and 6B are views illustrating a second internal electrode basepattern used in the method of manufacturing a multilayer electroniccomponent such as that shown in FIG. 1;

FIG. 7 is a top view showing relative positions of internal electrodebase patterns in a stack of first and second ceramic green sheets usedin the method of manufacturing a multilayer electronic component such asthat shown in FIG. 1;

FIG. 8 is a top view showing cutting lines or cutting surfaces on amultilayer bar used in the method of manufacturing a multilayerelectronic component such as that shown in FIG. 1; and

FIG. 9 is a side view illustrating first and second side parts disposedon outer surfaces of the body of a multilayer electronic component suchas that shown in FIG. 1.

DETAILED DESCRIPTION

Hereinafter, embodiments of the present disclosure will be described asfollows with reference to the attached drawings.

The present disclosure may, however, be exemplified in many differentforms and should not be construed as being limited to the specificembodiments set forth herein. Rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey the scope of the disclosure to those skilled in the art.

Throughout the specification, it will be understood that when anelement, such as a layer, region, or wafer (substrate), is referred toas being “on,” “connected to,” or “coupled to” another element, it canbe directly “on,” “connected to,”, or “coupled to” the other element orother elements intervening therebetween may be present. In contrast,when an element is referred to as being “directly on,” “directlyconnected to,” or “directly coupled to” another element, there may be noelements or layers intervening therebetween. Like numerals refer to likeelements throughout. As used herein, the term “and/or” includes any andall combinations of one or more of the associated listed items.

It will be apparent that though the terms first, second, third, etc. maybe used herein to describe various members, components, regions, layers,and/or sections, these members, components, regions, layers, and/orsections should not be limited by these terms. These terms are only usedto distinguish one member, component, region, layer, or section fromanother member, component, region, layer, or section. Thus, a firstmember, component, region, layer, or section discussed below could betermed a second member, component, region, layer, or section withoutdeparting from the teachings of the exemplary embodiments.

Spatially relative terms, such as “above,” “upper,” “below,” “lower,”and the like, may be used herein for ease of description to describe oneelement's positional relationship relative to one or more otherelement(s) as shown in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “above,” or “upper”relative to other elements would then be oriented “below,” or “lower”relative to the other elements or features. Thus, the term “above” canencompass both the above and below orientations depending on aparticular direction of the devices, elements, or figures. The devicemay be otherwise oriented (rotated 90 degrees or at other orientations)and the spatially relative descriptors used herein may be interpretedaccordingly.

The terminology used herein describes particular illustrativeembodiments only, and the present disclosure is not limited thereby. Asused herein, the singular forms “a,” “an,” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, members,elements, and/or groups, but do not preclude the presence or addition ofone or more other features, integers, steps, operations, members,elements, and/or groups.

Hereinafter, embodiments of the present disclosure will be describedwith reference to schematic views illustrating embodiments of thepresent disclosure. In the drawings, components having ideal shapes areshown. However, variations from these ideal shapes, for example due tovariability in manufacturing techniques and/or tolerances, also fallwithin the scope of the disclosure. Thus, embodiments of the presentdisclosure should not be construed as being limited to the particularshapes of regions shown herein, but should more generally be understoodto include changes in shape resulting from manufacturing methods andprocesses. The following embodiments may also be constituted by one or acombination thereof.

The present disclosure describes a variety of configurations, and onlyillustrative configurations are shown herein. However, the disclosure isnot limited to the particular illustrative configurations presentedherein, but extends to other similar/analogous configurations as well.

Multilayer Electronic Component

FIG. 1 is a schematic perspective view of a multilayer electroniccomponent according to an exemplary embodiment.

Referring to FIG. 1, the multilayer electronic component 100 accordingto an exemplary embodiment may include a body 1 including a multilayerstructure in which first and second internal electrode patterns arealternately stacked and containing a dielectric material, first andsecond side parts 21 and 22 disposed on outer surfaces of the body thatface each other (or are opposite to each other) in a third direction ofthe body 1, and first and second external electrodes 31 and 32 disposedon outer surfaces of the body to face each other (or be disposed onopposing surfaces of the body 1) in a second direction of the body 1.

The body 1 may have six outer surfaces including first and secondsurfaces opposing each other in a first direction, third and fourthsurfaces opposing each other in the second direction, and fifth andsixth surfaces opposing each other in the third direction. The body 1may have a substantially hexahedral shape, but is not limited thereto.

Referring to FIG. 1, the first direction refers to a thickness (T)direction of the body 1, the second direction refers to a length (L)direction of the body 1, and the third direction refers to a width (W)direction of the body 1. In this case, the first and second surfaces ofthe body 1 opposing each other in the first direction of the body 1 maybe upper and lower surfaces of the body, respectively, but are notlimited thereto.

Referring to FIG. 1, the first and second side parts 21 and 22 may bedisposed, respectively, on the fifth and sixth surfaces opposing eachother in the third direction among the outer surfaces of the body 1. Thefirst side part 21 may be disposed to contact the first internalelectrode patterns (e.g., shown at 11) exposed onto the fifth surface ofthe body 1, and the second side part 22 may be disposed to contact thesecond internal electrode patterns exposed onto the sixth surface of thebody 1. The first and second side parts 21 and 22 may be disposed inorder to prevent end portions of the first and second internal electrodepatterns exposed onto the outer surfaces of the body 1 from beingdamaged due to physical or chemical stress.

According to the related art, in a case in which a multilayer structureincluding first and second internal electrode patterns is printed into abody, the first and second internal electrode patterns are not exposedonto the outer surface of the body except for the outer surfaces of thebody on which the first and second external electrodes are disposed.Therefore, in the devices of the related art, there is no need tointroduce separate first and second side parts such as the first andsecond side parts 21 and 22 shown in FIG. 1.

However, in the multilayer electronic component according to anexemplary embodiment shown in FIG. 1, the first internal electrodepatterns (shown at numeral 11) may not only be exposed onto the outersurface of the body 1 on which the first external electrode 31 isdisposed, but may also be exposed onto the fifth surface of the body 1(on which the first side part 21 is disposed). In addition, the secondinternal electrode patterns may not only be exposed onto the outersurface of the body 1 on which the second external electrode 32 isdisposed, but may also be exposed onto the sixth surface of the body 1(on which the second side part 22 is disposed).

Therefore, the first and second side parts 21 and 22 used for preventingthe end portions of the first and second internal electrode patternsfrom being deformed due to external stress may be advantageouslyprovided.

The first and second side parts 21 and 22 are not necessarily disposedto cover the entire fifth and sixth surfaces of the body 1. That is, itmay be sufficient that the first and second side parts 21 and 22 aredisposed to cover the end portions of the first and second internalelectrode patterns exposed onto the outer surfaces of the body 1 on thefifth and sixth surfaces of the body 1.

Referring to FIG. 1, the first and second external electrodes 31 and 32may be disposed on the third and fourth surfaces of the body 1 opposingeach other in the second direction among the outer surfaces of the body1.

The first external electrode 31 may be electrically connected to thefirst internal electrode patterns within the body 11, and the secondexternal electrode 32 may be electrically connected to the secondinternal electrode patterns within the body 1.

The first and second external electrodes 31 and 32 may be formed of amaterial having excellent electrical conductivity, and may serve toelectrically connect various patterns as well as the first and secondinternal electrode patterns and external devices to each other.Therefore, the first and second external electrodes 31 and 32 maycontain a material having excellent electrical conductivity, such as Ni,Ag, or Pd, but are not limited thereto.

Next, FIGS. 2A through 2F are schematic cross-sectional views ofrespective outer surfaces of a body 1 according to an exemplaryembodiment. Here, internal electrode patterns that are exposed onto theouter surfaces of the body 1 are denoted by a solid line, and internalelectrode patterns that are not exposed onto the outer surfaces of thebody 1 are denoted by a two-dot chain line.

In detail, FIGS. 2A through 2F are cross-sectional views of the first tosixth outer surfaces of the body 1, respectively.

First, FIGS. 2A and 2B illustrate the first and second surfaces of thebody 1, respectively. The first and second surfaces of the body 1 may bethe upper and lower surfaces of the body 1, respectively. The upper andlower surfaces of the body 1 are upper and lower cover layers of thebody 1 and serve to protect the internal electrode patterns having amultilayer structure within the body 1 from external impact. The upperand lower surfaces may be formed by stacking ten or more ceramic sheetson which the internal electrode patterns are not formed, as an example.

Next, FIG. 2C illustrates the third surface of the body 1. The thirdsurface of the body 1 may be the outer surface of the body on which thefirst external electrode 31 is disposed. As illustrated in FIG. 2C, thefirst internal electrode patterns 11 may be exposed onto the thirdsurface of the body 1. The first internal electrode patterns 11 may becontinuously exposed from a point, spaced apart from one edge (or oneend portion) of the third surface of the body 1 by a predetermineddistance, to the other opposite edge (or opposite end portion) of thethird surface of the body 1 extended in the third direction of the body1. In this manner, the first internal electrode patterns 11 secure amaximum area for significantly increasing a capacitance value of thecapacitor by ensuring that the first internal electrode patterns 11overlap the second internal electrode patterns 12 within the body 1. Thefirst internal electrode patterns 11 are not exposed onto the sixthsurface of the body 1 onto which the second internal electrode patterns12 are exposed (the sixth surface of the body 1 being the surface havingthe second side part 22 disposed thereon). Similarly, the secondinternal electrode patterns 12 are not exposed onto the fifth surface ofthe body 1 onto which the first internal electrode patterns 11 areexposed (the fifth surface of the body 1 being the surface having thefirst side part 21 disposed thereon). Therefore, a risk that a shortcircuit between the first and second internal electrode patterns 11 and12 will be generated on the fifth surface of the body 1 (i.e., thesurface onto which the first internal electrode patterns 11 are exposed)may be completely prevented.

Meanwhile, a distance by which the first internal electrode patterns 11are spaced apart from one edge (or end portion) of the third surface ofthe body 1 may be set to be equal to a distance by which the firstinternal electrode patterns 11 are spaced apart from the sixth surfaceof the body 1. In a case in which only this condition is satisfied, whenthe spacing distance becomes minimized, an overlapping region as largeas possible between the first and second internal electrode patterns 11and 12 may be secured, and thus capacitance as large as possible may besecured.

Next, FIG. 2D illustrates the fourth surface of the body 1. The fourthsurface of the body 1 may be the outer surface of the body 1 on whichthe second external electrode 32 is disposed. As illustrated in FIG. 2D,the second internal electrode patterns 12 may be exposed onto the fourthsurface of the body 1. The second internal electrode patterns 12 may becontinuously exposed from a point, spaced apart from one edge (or oneend portion) of the fourth surface of the body 1 by a predetermineddistance, to the other opposite edge (or opposite end portion) of thefourth surface of the body 1 extended in the third direction of the body1. In this manner, the second internal electrode patterns 12 secure amaximum area for significantly increasing a capacitance value of thecapacitor by ensuring that the second internal electrode patterns 12overlap the first internal electrode patterns 11 within the body 1. Thesecond internal electrode patterns 12 are not exposed onto the fifthsurface of the body 1 onto which the first internal electrode patterns11 are exposed (the fifth surface of the body 1 being the surface havingthe first side part 21 disposed thereon). Similarly, the first internalelectrode patterns 11 are not exposed onto the sixth surface of the body1 onto which the second internal electrode patterns 12 are exposed (thesixth surface of the body 1 being the surface having the second sidepart 22 disposed thereon) Therefore, a risk that a short circuit betweenthe first and second internal electrode patterns 11 and 12 will begenerated on the sixth surface of the body 1 (i.e., the surface ontowhich the second internal electrode patterns 12 are exposed) may becompletely prevented.

Meanwhile, a distance by which the second internal electrode patterns 12are spaced apart from one edge (or end portion) of the fourth surface ofthe body 1 may be set to be equal to a distance by which the secondinternal electrode patterns 12 are spaced apart from the fifth surfaceof the body 1. In a case in which only this condition is satisfied, whenthe spacing distance becomes minimized, an overlapping region as largeas possible between the first and second internal electrode patterns 11and 12 may be secured, and thus capacitance as large as possible may besecured.

Next, FIG. 2E illustrates the fifth surface of the body 1. The fifthsurface of the body 1 may be the outer surface of the body on which thefirst side part 21 is disposed. As illustrated in FIG. 2E, only thefirst internal electrode patterns 11 (from among the first and secondinternal electrode patterns 11 and 12) may be exposed onto the fifthsurface of the body 1. Thus, the second internal electrode patterns 12may not be exposed onto the fifth surface of the body 1. Since only thefirst internal electrode patterns 11 (from among the first and secondinternal electrode patterns 11 and 12) are exposed onto the fifthsurface of the body 1, there is no risk that an unintended short circuitbetween the first and second internal electrode patterns 11 and 12 willbe generated on the fifth surface.

For example, in a case in which a cutting process is performed along thefifth surface of the body 1 (for example, in a case in which amultilayer bar in which first and second ceramic green sheets havingfirst and second internal electrode base patterns printed thereon arealternately stacked is cut into individualized bodies along the fifthsurface), when both of the first and second internal electrode patterns11 and 12 are alternately exposed onto the fifth surface of the body 1,a phenomenon that the first and second internal electrode patterns 11and 12 are pushed due to stress when the cutting process is performedmay occur, and thus there is a risk of a short circuit between the firstand second internal electrode patterns 11 and 12.

However, in the multilayer electronic component according to anexemplary embodiment described herein, since only the first internalelectrode patterns 11 are exposed onto the fifth surface of the body 1,even in a case in which the first and second internal electrode patterns11 and 12 are pushed due to stress when the cutting process isperformed, there is no risk of a short circuit between the first andsecond internal electrode patterns 11 and 12. In addition, in themultilayer electronic component according to an exemplary embodiment,since only the first internal electrode patterns 11 are exposed onto thefifth surface of the body 1, a distance between the first internalelectrode patterns 11 in the thickness direction of the body 1 may belarger than a distance between the first and second internal electrodepatterns 11 and 12 in a case in which the first and second internalelectrode patterns 11 and 12 are alternately exposed onto the fifth andsixth surfaces of the body 1 according to the related art. Therefore,even in the case in which the first and second internal electrodepatterns 11 and 12 are pushed due to stress when the cutting process isperformed, there is no risk of a short circuit between the first andsecond internal electrode patterns 11 and 12.

In addition, referring to FIG. 2E, the first internal electrode patterns11 may be extended from one edge (or one end portion) of the fifthsurface of the body 1 only to a point spaced apart by a predeterminedspacing distance from the other opposing edge (or end portion) of thefifth surface of the body 1 extended in the second direction of the body1. That is, a length by which the first internal electrode patterns 11are extended in the second direction of the body 1 may be shorter than alength by which the fifth surface of the body 1 is extended in thesecond direction.

The predetermined spacing distance is generally set to be larger than alength by which the second external electrode 32, disposed on the fourthsurface of the body 1, is extended onto the fifth surface of the body 1,in order to prevent electrical connection between the first internalelectrode patterns 11 and the second external electrode 32 on the fifthsurface of the body 1.

Next, FIG. 2F illustrates the sixth surface of the body 1. The sixthsurface of the body 1 may be the outer surface of the body 1 on whichthe second side part 22 is disposed. As illustrated in FIG. 2F, only thesecond internal electrode patterns 12 (from among the first and secondinternal electrode patterns 11 and 12) may be exposed onto the sixthsurface of the body 1. Thus, the first internal electrode patterns 11may not be exposed onto the sixth surface of the body 1. Since only thesecond internal electrode patterns 12 (from among the first and secondinternal electrode patterns 11 and 12) are exposed onto the sixthsurface of the body 1, there is no risk that an unintended short circuitbetween the first and second internal electrode patterns 11 and 12 willbe generated on the sixth surface.

In addition, referring to FIG. 2F, the second internal electrodepatterns 12 may be extended from one edge (or one end portion) of thesixth surface of the body 1 only to a point spaced apart by apredetermined spacing distance from the other opposing edge (or endportion) of the sixth surface of the body 1 extended in the seconddirection of the body 1. That is, a length by which the second internalelectrode patterns 12 are extended in the second direction of the body 1may be shorter than a length by which the sixth surface of the body 1 isextended in the second direction.

The predetermined spacing distance is generally set to be larger than alength by which the first external electrode 31, disposed on the thirdsurface of the body 1, is extended onto the sixth surface of the body 1,in order to prevent electrical connection between the second internalelectrode patterns 12 and the first external electrode 31 on the sixthsurface of the body 1.

FIG. 3 is an exploded perspective view schematically illustrating thefirst and second internal electrodes 11 and 12 that are alternatelystacked.

Referring to FIG. 3, the first internal electrode patterns 11 may bedisposed to be exposed onto the fifth surface of the body 1 on which thefirst side part 21 is disposed and the third surface of the body 1 onwhich the first external electrode 31 is disposed among the outersurfaces of the body 1. Since the first internal electrode patterns 11are exposed onto the fifth surface of the body 1 as well as the thirdsurface of the body 1, the first internal electrode patterns 11 may bevulnerable to external physical or chemical stress, but maximumcapacitance may be secured. Meanwhile, in order to address the fact thatthe end portions of the first internal electrode patterns 11 exposedonto the fifth surface of the body 1 are vulnerable to physical orchemical stress, the first side part 21 may be disposed to contact theend portions of the first internal electrode patterns 11 exposed ontothe fifth surface of the body 1.

In addition, the second internal electrode patterns 12 may have the sameshape as that of the first internal electrode patterns 11, but may bepatterns disposed to be spaced apart from the first internal electrodepatterns 11 by predetermined intervals in the second and thirddirections of the body 1.

The second internal electrode patterns 12 may be disposed to be exposedonto the sixth surface of the body 1 on which the second side part 22 isdisposed and the fourth surface of the body 1 on which the secondexternal electrode 32 is disposed among the outer surfaces of the body1. Since the second internal electrode patterns 12 are exposed onto thesixth surface of the body 1 as well as the fourth surface of the body 1,the second internal electrode patterns 12 may be vulnerable to externalphysical or chemical stress, but maximum capacitance may be secured.

Meanwhile, in order to address the fact that the end portions of thesecond internal electrode patterns 12 exposed onto the sixth surface ofthe body 1 are vulnerable to physical or chemical stress, the secondside part 22 may be disposed to contact the end portions of the secondinternal electrode patterns 12 exposed onto the sixth surface of thebody 1.

FIG. 4 illustrates a mounting board on which the multilayer electroniccomponent according to an exemplary embodiment is mounted.

Referring to FIG. 4, the mounting board 200 may include a board 210 onwhich the multilayer electronic component 100 is mounted, and first andsecond electrode pads 221 and 222 formed on the board 210 to be spacedapart from each other.

Here, the multilayer electronic component 100 may be electricallyconnected to the board 210 by solders 230 such that the first and secondexternal electrodes 31 and 32 thereof are positioned on the first andsecond electrode pads 221 and 222, respectively, and electricallycontact the first and second electrode pads 221 and 222, respectively.

Method of Manufacturing Multilayer Electronic Component

Hereinafter, a method of manufacturing a multilayer electronic componentaccording to an exemplary embodiment will be described with reference toFIGS. 5A, 5B, 6A, 6B, and 7 through 9.

First, FIGS. 5A and 5B illustrate a first ceramic green sheet on which afirst internal electrode base pattern 11 a is printed.

Referring to FIG. 5A, a slurry containing a powder having a dielectricproperty, a binder, and a solvent may be applied onto a substrate suchas a carrier film to form a first ceramic green sheet, and the firstinternal electrode base pattern 11 a may be printed on the first ceramicgreen sheet.

The powder having the dielectric property, which is a high-k material,may be a barium titanate based material, a lead composite perovskitebased material, a strontium titanate based material, or the like, andmay preferably be a barium titanate powder, but is not limited thereto.

The purpose of the binder may be to secure dispersibility and viscosityof the powder having the dielectric property, and viscosity of theslurry may be adjusted by adjusting an amount of the binder. The bindermay be an organic binder resin, for example, a resin such as ethylcellulose, polyvinyl butyral, and the like, but is not limited thereto.

The first internal electrode base pattern 11 a may be formed of aconductive metal having excellent electrical conductivity, and maycontain one or more selected from the group consisting of Ag, Ni, Cu,Pd, and alloys thereof, but is not limited thereto.

The first internal electrode base pattern 11A may include one, two, ormore strip shapes spaced apart from each other by a predetermineddistance in a width direction of the first ceramic green sheet. Eachstrip shape may be a square shape having lengths in the length directionand the width direction that are the same as (or equal to) each other,or a rectangular shape having a length in the length direction that islonger than a length in the width direction, but is not limited thereto.

In addition, the first internal electrode base pattern 11 a may bedisposed to be offset from a central portion of the first ceramic greensheet in the length direction and the width direction. For example, acenter of the first internal electrode base pattern may be offset from acenter of the first ceramic green sheet in the length and widthdirections. In this case, a second ceramic green sheet on which a secondinternal electrode base pattern is printed may be more easily stacked onthe first ceramic green sheet.

In addition, the first internal electrode base pattern 11 a may not beprinted on (e.g., may be spaced part from) one edge (or one end portion)of the first ceramic green sheet in a length direction of the firstceramic green sheet. In this case, the first internal electrode basepattern 11 a may not be exposed to an outer surface of a body (e.g.,body 1) formed of a stack of ceramic green sheets including the firstceramic green sheet, and on which the second external electrode 32 isdisposed without performing an additional cutting process later.

In addition, referring to FIG. 5B, the first internal electrode basepattern 11 a may have a plurality of strip shapes that are not onlyarranged at regular intervals linearly in the width direction, but arealso arranged to be spaced apart from each other by a predeterminedinterval in a two-dimensional array extending in the length direction ofthe first ceramic green sheet.

Referring to FIG. 6A, a second internal electrode base pattern 12 a maybe printed on a second ceramic green sheet.

The second internal electrode base pattern 12 a may be printed on thesecond ceramic green sheet at a position that is substantially the sameas the position at which the first internal electrode base pattern 11 ais printed on the first ceramic green sheet. In this case, when thefirst and second ceramic green sheets are stacked, a plurality of sheetsneed to be stacked to be misaligned with each other by predeterminedintervals in the width direction and the length direction.

Alternatively, the second internal electrode base pattern 12 a may beprinted on the second ceramic green sheet at a position that is spacedapart from the position at which the first internal electrode basepattern 11 a is printed on the first ceramic green sheet bypredetermined intervals in the width direction and the length direction.In this case, a plurality of sheets may be stacked so that both endportions of the first and the second ceramic green sheets in the widthdirection and both end portions of the first and the second ceramicgreen sheets in the length direction coincide with each other.

Meanwhile, referring to FIG. 6B, the second internal electrode basepattern 12 a may have a plurality of strip shapes that are not onlyarranged at regular intervals linearly in the width direction, but arealso arranged to be spaced apart from each other by a predeterminedinterval in a two-dimensional array extending in the length direction ofthe second ceramic green sheet.

Next, referring to FIG. 7, a top view of a stack of first and secondceramic green sheets on which the first and second internal electrodebase patterns 11 a and 12 a are disposed is illustrated.

In this case, when viewing a multilayer bar in which the first ceramicgreen sheets having the first internal electrode base patterns 11 aprinted thereon and the second ceramic green sheets having the secondinternal electrode base patterns 12 a printed thereon are stacked on topof each other, it may be appreciated that the first and second internalelectrode base patterns 11 a and 12 a that have substantially the sameshape alternately overlap each other to be misaligned with each other bypredetermined intervals in the width direction and the length direction.

Although only a case in which the first and second internal electrodebase patterns 11 a and 12 a alternately overlap each other to bemisaligned with each other by the same interval in the width directionand the length direction has been illustrated in FIG. 7, a misalignedlevel may be appropriately selected in consideration of a manufacturingprocess or required performance of a chip. In this case, the larger theoverlapping region between the first and second internal electrode basepatterns 11 a and 12 a, the larger the capacitance of the resultingmultilayer electronic component.

In addition, FIG. 8 is a top perspective view illustrating cutting linesor cutting surfaces of a multilayer bar in which the first ceramic greensheets having the first internal electrode base patterns 11 a printedthereon and the second ceramic green sheets having the second internalelectrode base patterns 12 a printed thereon are stacked.

The cutting lines or cutting surfaces may be formed along end portions(or edge portions) of strips within the first internal electrode basepattern 11 a and end portions of strips within the second internalelectrode base pattern 12 a. Therefore, end portions of first internalelectrode patterns 11 a may be exposed onto surfaces of individualizedbodies on which first external electrodes (e.g., 31) are disposed andsurfaces of the individualized bodies on which first side parts (e.g.,21) are disposed among outer surfaces of the individualized bodies, andend portions of second internal electrode patterns 12 a may be exposedonto surfaces of the individualized bodies on which second externalelectrodes (e.g., 32) are disposed and surfaces of the individualizedbodies on which second side parts (e.g., 22) are disposed among theouter surfaces of the individualized bodies.

The multilayer bar in which the first and second ceramic green sheetsare stacked may be cut into individualized bodies each including amultilayer structure in which first and second internal electrodepatterns 11 and 12 are alternately stacked and containing a dielectricmaterial through the cutting process along the cutting lines or cuttingsurfaces. The first internal electrode patterns 11 within the body maybe exposed onto outer surfaces of the body 1 except for a surface of thebody 1 on which the second external electrode 32 connected to the secondinternal electrode patterns 12 is to be disposed, and the secondinternal electrode patterns 12 within the body may be exposed onto outersurfaces of the body except for a surface of the body on which the firstexternal electrode 31 connected to the first internal electrode patterns11 is to be disposed.

In addition, a process of cutting the multilayer bar in which the firstand second ceramic green sheets are stacked will be described in detail.The first and second internal electrode base patterns 11 a and 12 awithin the multilayer bar may be cut by different cutting surfaces. Inother words, a cutting surface of the first internal electrode basepattern 11 a may not meet the second internal electrode base pattern 12a, and a cutting surface of the second internal electrode base pattern12 a may not meet the first internal electrode base pattern 11 a.

As a result, a negative effect that a short circuit between the firstand second internal electrode patterns 11 a and 12 a is generated due tothe phenomenon that the first and second internal electrodes 11 a and 12a are pushed in a process of cutting the multilayer bar into individualchips may be prevented.

In this case, when the first internal electrode base pattern 11 a iscut, apart of a region in which the first and second internal electrodebase patterns 11 a and 12 a do not overlap each other (e.g., betweenadjacent strip shapes in the first internal electrode base pattern 11 a)may be cut. It may be preferable that the first internal electrode basepattern 11 a is cut along end portions of the strip shapes in the firstinternal electrode base pattern 11 a, in consideration of efficiency ina manufacturing process and economic efficiency. This may also beapplied to a case of cutting the second internal electrode base pattern12 a.

Referring to FIG. 9, the first and second side parts 21 and 22 may bedisposed, respectively, on the fifth and sixth surfaces of the body 1among the outer surfaces of the body 1. Only the first internalelectrode patterns 11, among the first and second internal electrodepatterns 11 and 12, may be exposed onto the fifth surface of the body 1,and only the second internal electrode patterns 12, among the first andsecond internal electrode patterns 11 and 12, may be exposed onto thesixth surface of the body 1. The first and second side parts 21 and 22may be formed by applying a slurry to protect the end portions of thefirst and second internal electrode patterns 11 and 12 exposed onto thefifth and sixth surfaces of the body 1, respectively, from physical orchemical stress. Since the first and second side parts 21 and 22 aredisposed on only the fifth and sixth surfaces of the body 1,respectively, by selectively applying the slurry onto only the fifth andsixth surfaces of the body 1, thicknesses in the first and secondsurfaces of the body 1 may not be affected by the application of theslurry.

Meanwhile, in order to selectively apply the slurry onto only the fifthand sixth surfaces of the body 1, for example, a method may includeattaching detachable films onto the outer surfaces of the body 1 exceptfor the fifth and sixth surfaces of the body 1, dipping the body 1 intothe slurry, and removing the detachable films attached onto the outersurfaces of the body 1. However, a method of applying the slurry ontoonly the fifth and sixth surfaces of the body 1 is not limited thereto,and other appropriate methods can be used.

The slurry forming the first and second side parts 21 and 22 may containthe powder having the dielectric property, the binder, and the organicsolvent.

In this case, the first side part 21 may be disposed by applying a firstslurry containing a solvent compatible with a binder contained in anelectrode paste forming the second internal electrode base pattern 12onto the outer surface of the body 1, and the second side part 22 may bedisposed by applying a second slurry containing a solvent compatiblewith a binder contained in an electrode paste forming the first internalelectrode base pattern 11 onto the outer surface of the body 1. Thisstructure is possible since the first side part 21 and the secondinternal electrode patterns 12 do not contact each other and the secondside part 22 and the first internal electrode pattern 11 do not contacteach other.

Next, the first and second external electrodes 31 and 32 may be disposedon the third and fourth surfaces of the body 1, respectively. The firstexternal electrode 31 may be electrically connected to the firstinternal electrode patterns 11, and may be disposed to be extended tosome regions of the first, second, fifth, and sixth surfaces of the body1 adjacent to the third surface of the body 1, in addition to the thirdsurface of the body 1. Likewise, the second external electrode 32 may beelectrically connected to the second internal electrode patterns 12, andmay be disposed to be extended to some regions of the first, second,fifth, and sixth surfaces of the body 1 adjacent to the fourth surfaceof the body 1, in addition to the fourth surface of the body 1.

As set forth above, according to an exemplary embodiment, a multilayerelectronic component is provided that has capacitance that is increasedby significantly increasing an active region contributing to generationof capacitance. The active region is increased by strategicallydisposing internal electrode patterns of the multilayer electroniccomponent. A method of manufacturing the same is also provided.

According to an exemplary embodiment, a multilayer electronic componentis provided in which short circuits between internal electrodesalternately formed between a plurality of sheets is prevented. A methodof manufacturing the same is also provided.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentinvention as defined by the appended claims.

What is claimed is:
 1. A multilayer electronic component comprising: abody including a multilayer structure in which first and second internalelectrode patterns are alternately stacked, containing a dielectricmaterial, and having outer surfaces including first and second outersurfaces opposing each other in a first direction, third and fourthouter surfaces opposing each other in a second direction, and fifth andsixth outer surfaces opposing each other in a third direction; first andsecond external electrodes disposed, respectively, on the third andfourth outer surfaces among the outer surfaces of the body, andelectrically connected to the first and second internal electrodepatterns, respectively; and first and second side parts disposed,respectively, on the fifth and sixth outer surfaces among the outersurfaces of the body, wherein the first internal electrode patterns areexposed to the third outer surface and the fifth outer surface of thebody on which the first external electrode and the first side part aredisposed, respectively, the second internal electrode patterns areexposed to the fourth outer surface and the sixth outer surface of thebody on which the second external electrode and the second side part aredisposed, respectively, both the first side part and the second externalelectrode are directly disposed on the fifth outer surface, and both thesecond side part and the first external electrode are directly disposedon the sixth outer surface, and a length of each of the first and secondside parts in the second direction is smaller than a distance betweenthe third and fourth outer surfaces opposing each other in the seconddirection.
 2. The multilayer electronic component of claim 1, whereinthe first internal electrode patterns are exposed to only the thirdouter surface and the fifth outer surface of the body, on which thefirst external electrode and the first side part are disposed, among theouter surfaces of the body, and the second internal electrode patternsare exposed to only the fourth outer surface and the sixth outer surfaceof the body, on which the second external electrode and the second sidepart are disposed, among the outer surfaces of the body.
 3. Themultilayer electronic component of claim 1, wherein the first internalelectrode patterns are exposed on the third surface of the body from onepoint of an edge formed by the third surface and the fifth surface ofthe body to a point spaced apart by a predetermined distance from anopposite edge of the third surface of the body, and are exposed on thefifth surface of the body from the one point of the edge formed by thethird surface and the fifth surface of the body to a point spaced apartby a predetermined distance from an opposite edge of the fifth surfaceof the body.
 4. The multilayer electronic component of claim 3, whereinthe second internal electrode patterns are exposed on the fourth surfaceof the body from one point of an edge formed by the fourth surface andthe sixth surface of the body to a point spaced apart by a predetermineddistance from an opposite edge of the fourth surface of the body, andare exposed on the sixth surface of the body from the one point of theedge formed by the fourth surface and the sixth surface of the body to apoint spaced apart by a predetermined distance from an opposite edge ofthe sixth surface of the body.
 5. The multilayer electronic component ofclaim 1, wherein the first side part is disposed to cover all of thefirst internal electrode patterns exposed to the fifth outer surface ofthe body on which the first side part is disposed, and the second sidepart is disposed to cover all of the second internal electrode patternsexposed to the sixth outer surface of the body on which the second sidepart is disposed.
 6. The multilayer electronic component of claim 1,wherein the first and second internal electrode patterns each haverectangular strip shapes that are the same shape as each other, and thefirst and second internal electrode patterns are stacked in a verticaldirection such that the first internal electrode patterns are offset ina horizontal direction with respect to the second internal electrodepatterns in the body.
 7. The multilayer electronic component of claim 1,wherein the first and second internal electrode patterns are disposedparallel to the first and second outer surfaces of the body opposingeach other in the first direction.
 8. The multilayer electroniccomponent of claim 1, wherein a shape of the first internal electrodepatterns is the same as a shape of the second internal electrodepatterns.
 9. The multilayer electronic component of claim 1, wherein alength of the first internal electrode pattern exposed to the thirdsurface of the body is the same as a length of the second internalelectrode pattern exposed to the fourth surface of the body, and alength of the first internal electrode pattern exposed to the fifthsurface of the body is the same as a length of the second internalelectrode pattern exposed to the sixth surface of the body.
 10. A methodof manufacturing a multilayer electronic component, the methodcomprising: forming first and second ceramic green sheets using a slurrycontaining a powder having a dielectric property, a binder, and asolvent; printing first and second internal electrode base patterns onone surface of the first and second ceramic green sheets, respectively,the first and second internal electrode base patterns including one ormore strip shapes that are the same shape as each other; alternatelystacking the first ceramic green sheets including the first internalelectrode base patterns and the second ceramic green sheets includingthe second internal electrode base patterns; cutting a multilayer bar inwhich the first and second ceramic green sheets are stacked to formindividual bodies each including a multilayer structure in which firstand second internal electrode patterns are alternately stacked andcontaining a dielectric material; disposing first and second side partson respective first and second opposing outer surfaces of each body toeach cover less than an entirety of the respective first or secondopposing outer surface of the body; and disposing first and secondexternal electrodes on respective third and fourth outer surfaces ofeach body opposing each other in a first direction, wherein a length ofeach of the first and second side parts in the first direction issmaller than a distance between the third and fourth outer surfacesopposing each other in the first direction, and wherein the firstexternal electrode is further disposed on a portion of the firstopposing outer surface of each body that is free of the first side part,and the second external electrode is further disposed on a portion ofthe second opposing outer surface of each body that is free of thesecond side part.
 11. The method of claim 10, wherein the first andsecond internal electrode base patterns are printed to each have a shapein which one or more strips are spaced apart from each other by apredetermined interval in a width direction of the first and secondceramic green sheets.
 12. The method of claim 10, wherein the alternatestacking of the first ceramic green sheets and the second ceramic greensheets includes stacking of the first and second ceramic green sheetssuch that positions at which the one or more strips are disposed on thefirst ceramic green sheets overlap with positions at which the one ormore strips are disposed on the second ceramic green sheets, andstacking the first ceramic green sheets and the second ceramic greensheets such that the strips disposed thereon are offset with respect toeach other by predetermined intervals in a width direction and a lengthdirection.
 13. The method of claim 10, wherein the alternately stackingof the first ceramic green sheets and the second ceramic green sheetsincludes offsetting positions at which the one or more strips aredisposed on the first ceramic green sheets with respect to positions atwhich the one or more strips are disposed on the second ceramic greensheets, and stacking the first ceramic green sheets and the secondceramic green sheets so that edges of the first and second ceramic greensheets in a width direction and edges of the first and second ceramicgreen sheets in a length direction overlap with each other.
 14. Themethod of claim 10, wherein the cutting of the multilayer bar in whichthe first and second ceramic green sheets are stacked includes: themultilayer bar being cut between a first region in which the strip shapein the first internal electrode base pattern and the strip shape in thesecond internal electrode base pattern overlap each other and an edge ofthe strip shape in the first internal electrode base pattern extendingfrom the first region, and the multilayer bar being cut between thefirst region in which the strip shape in the first internal electrodebase pattern and the strip shape in the second internal electrode basepattern overlap each other and an edge of the strip shape in the secondinternal electrode base pattern extending from the first region.
 15. Themethod of claim 14, wherein the multilayer bar is cut along an edge ofthe strip shape in the first internal electrode base pattern and an edgeof the strip shape in the second internal electrode base pattern toallow edges of the first internal electrode patterns to be exposed ontothe outer surfaces on which the first external electrode and the firstside part are disposed and allow edges of the second internal electrodepatterns to be exposed onto the outer surfaces on which the secondexternal electrode and the second side part are disposed.
 16. The methodof claim 10, wherein the first side part is disposed to contact only thefirst internal electrode patterns from among the first and secondinternal electrode patterns, and the second side part is disposed tocontact only the second internal electrode patterns from among the firstand second internal electrode patterns.
 17. The method of claim 10,wherein the first side part is formed by applying a first slurrycontaining a solvent compatible with a binder contained in an electrodepaste forming the second internal electrode base pattern onto at leastthe first outer surface of the body, and the second side part is formedby applying a second slurry containing a solvent compatible with abinder contained in an electrode paste forming the first internalelectrode base pattern onto at least the second outer surface of thebody.
 18. A multilayer electronic component comprising: a body includingalternately stacked first and second internal electrodes disposed in adielectric body; first and second side parts disposed, respectively, onopposing first and second outer surfaces of the body; and first andsecond external electrodes disposed, respectively, on third and fourthouter surfaces of the body opposing each other in a first direction,wherein the first and second internal electrodes each have rectangularstrip shapes that are the same shape as each other, and the first andsecond internal electrodes are stacked in a vertical direction such thatthe first internal electrodes are offset in a horizontal direction withrespect to the second internal electrodes in the body, a length of eachof the first and second side parts in the first direction is smallerthan a distance between the third and fourth outer surfaces opposingeach other in the first direction, the first and second outer surfacesof the body each include a first portion in which at least one of thefirst and second internal electrodes are exposed, and a second portionthat is free of the first and second internal electrodes, and the firstand second side parts each cover the first portion of the respectivefirst or second opposing outer surface of the body, and the first andsecond external electrodes each extend onto the second portion of therespective first and second opposing outer surface of the body.
 19. Themultilayer electronic component of claim 18, wherein: the first internalelectrodes are exposed to the first and third outer surfaces of thebody, and the second internal electrodes are exposed to the second andfourth outer surfaces of the body different from the first and thirdouter surfaces of the body.
 20. The multilayer electronic component ofclaim 19, wherein the first and second internal electrodes are disposedparallel to opposing fifth and sixth surfaces of the body.
 21. Themultilayer electronic component of claim 19, wherein: each rectangularstrip shaped first internal electrode has a first edge coincident withthe first outer surface of the body and a second edge coincident withthe third outer surface of the body, and each rectangular strip shapedsecond internal electrode has a first edge coincident with the secondouter surface of the body and a second edge coincident with the fourthouter surface of the body.
 22. The multilayer electronic component ofclaim 21, wherein each rectangular strip shaped first internal electrodehas third and fourth edges parallel to and spaced apart from the secondand fourth outer surfaces of the body; and each rectangular strip shapedsecond internal electrode has third and fourth edges parallel to andspaced apart from the first and third outer surfaces of the body. 23.The multilayer electronic component of claim 19, wherein a firstinternal electrode is exposed on the first and third outer surfaces ofthe body continuously from a first point spaced apart from edges of thefirst outer surface to a second point disposed at an edge common to thefirst and third outer surfaces, and continuously from the second pointto a third point spaced apart from edges of the third outer surface, anda second internal electrode is exposed on the second and fourth outersurfaces of the body continuously from a fourth point spaced apart fromedges of the second outer surface to a fifth point disposed at an edgecommon to the second and fourth adjacent outer surfaces, and from thefifth point to a sixth point spaced apart from edges of the fourth outersurface.
 24. The multilayer electronic component of claim 19, whereinthe first and second external electrodes are conductive; and the firstand second side parts are non-conductive.
 25. A method comprising:alternately stacking first and second ceramic green sheets in a verticaldirection to form a multilayer bar, wherein: the first and secondceramic green sheets each respectively have first and second internalelectrodes disposed thereon, each of the first and second internalelectrodes includes two or more rectangular strip shapes that are thesame shape as each other and spaced apart from each other, and the firstand second ceramic green sheets are stacked such that the first internalelectrodes are offset in a horizontal direction with respect to thesecond internal electrodes in the multilayer bar; cutting the multilayerbar along at least one vertical cutting surface to form two or moreindividualized bodies, wherein the cutting of the multilayer bar exposeson one vertical cutting surface only the first internal electrodes fromamong the first and second internal electrodes; disposing a first sidepart on a portion of the one vertical cutting surface in which the firstinternal electrodes are exposed in each body; and disposing a firstexternal electrode to extend on at least another portion of the onevertical cutting surface that is free of the first internal electrodesin each body, wherein a length of the first side part in the horizontaldirection along the one vertical cutting surface is smaller than alength of the one vertical cutting surface in the horizontal direction.26. The method of claim 25, wherein the cutting the multilayer barexposes on another vertical cutting surface only the second internalelectrodes from among the first and second internal electrodes.
 27. Themethod of claim 25, wherein the cutting the multilayer bar comprisescutting the multilayer bar along the at least one vertical cuttingsurface to expose the first internal electrodes to first and secondadjacent outer surfaces of a body, and to expose the second internalelectrodes to third and fourth adjacent outer surfaces of the bodydifferent from the first and second outer surfaces of the body.
 28. Themethod of claim 25, further comprising: disposing second side parts onfirst portions of outer surfaces of each body opposing the one verticalcutting surface; and disposing second external electrodes on secondportions, different from the first portions, of the outer surfaces ofeach body opposing the one vertical cutting surface.
 29. The method ofclaim 28, wherein the first side part is insulating, and is disposed onthe one vertical cutting surface exposing only the first internalelectrodes from among the first and second internal electrodes.
 30. Amultilayer electronic component comprising: a body including amultilayer structure in which first and second internal electrodepatterns are alternately stacked, containing a dielectric material, andhaving outer surfaces including first and second outer surfaces opposingeach other in a first direction, third and fourth outer surfacesopposing each other in a second direction, and fifth and sixth outersurfaces opposing each other in a third direction; first and secondexternal electrodes disposed, respectively, on the third and fourthouter surfaces among the outer surfaces of the body, and electricallyconnected to the first and second internal electrode patterns,respectively; and first and second side parts disposed, respectively, onthe fifth and sixth outer surfaces among the outer surfaces of the body,wherein the first internal electrode patterns are exposed to the thirdouter surface and the fifth outer surface of the body on which the firstexternal electrode and the first side part are disposed, respectively,the second internal electrode patterns are exposed to the fourth outersurface and the sixth outer surface of the body on which the secondexternal electrode and the second side part are disposed, respectively,and both the first side part and the second external electrode aredirectly disposed on portions of the first internal electrode patternsexposed to the fifth outer surface, and both the second side part andthe first external electrode are directly disposed on portions of thesecond internal electrode patterns exposed to the sixth outer surface.31. The multilayer electronic component of claim 30, wherein the firstinternal electrode patterns are exposed to only the third outer surfaceand the fifth outer surface of the body, on which the first externalelectrode and the first side part are disposed, among the outer surfacesof the body, and the second internal electrode patterns are exposed toonly the fourth outer surface and the sixth outer surface of the body,on which the second external electrode and the second side part aredisposed, among the outer surfaces of the body.
 32. The multilayerelectronic component of claim 30, wherein the first side part isdisposed to cover all of the first internal electrode patterns exposedto the fifth outer surface of the body on which the first side part isdisposed, and the second side part is disposed to cover all of thesecond internal electrode patterns exposed to the sixth outer surface ofthe body on which the second side part is disposed.
 33. The multilayerelectronic component of claim 30, wherein the first and second internalelectrode patterns each have rectangular strip shapes that are the sameshape as each other, and the first and second internal electrodepatterns are stacked in a vertical direction such that the firstinternal electrode patterns are offset in a horizontal direction withrespect to the second internal electrode patterns in the body.